Wafer Dicing Solution LED Dicing Solution Glass Dicing Solution QFN Dicing Solution Kodis Saw Sevice Kodis Blade Data

QFN Dicing Solution   KMR Series for Metal Substrates(QFN) : Metal-Resin Bond KMR 90 - 58 40 200 - A 3 Specification Code Grit Size 35 30 ~ 40 45 40 ~ 50 50 40 ~ 60 55 50 ~ 60 70 60 ~ 80 80 70 ~ 90 90 80 ~ 100 100 90 ~ 110 O. D. ,mm I. D. ,mm 60 ~ 55 40 76 40.0 50.8 52.0 55.0 117~114 88.9 Thickness 200 ~ 1,000um Tolerance A +/- 5 B +/- 7.5 C +/- 10 D +/- 15 E +/- 20 Concentration 1 25 2 50 3 75 4 100 5 125 S   KM Series for BGAs : Metal-Sintered KM 40 - 58 40 250 - A P 4 4 N Specification Code Grit Size 20 15 ~ 250 25 20 ~ 30 35 30 ~ 40 40 35 ~ 45 45 40 ~ 50 50 45 ~ 55 55 50 ~ 60 O. D. ,mm I. D. ,mm 77 ~ 55 40 ~ 55 Thickness 200 ~ 1,000um Internal Code Internal Code : May not designated in specification Tolerance A +/- 5 B +/- 7.5 C +/- 10 D +/- 15 E +/- 20 S   Bond Type P Soft M Medium G Hard Concentration 1 25 2 50 3 75 4 100 5 125 Slit 0 0 1 8 2 16 3 24 4 32 S   Surface Factor N Z C

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