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KH 3 - 08 20 |
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规格说明 |
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单位 : um |
金刚石颗粒尺寸 |
1 |
0 ~ 2 |
2 |
1 ~ 3 |
3 |
2 ~ 4 |
4 |
2 ~ 6 |
5 |
4 ~ 6 |
6 |
4 ~ 8 |
10 |
8 ~ 16 | |
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划痕宽度 |
08 |
15 ~ 20 |
10 |
20 ~ 25 |
12 |
25 ~ 30 |
14 |
30 ~ 35 |
16 |
35 ~ 40 |
18 |
40 ~ 45 |
20 |
45 ~ 50 |
22 |
50 ~ 60 | |
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刀刃伸出量 |
10 |
250 ~ 380 |
15 |
380 ~ 510 |
20 |
510 ~ 640 |
25 |
640 ~ 760 |
30 |
760 ~ 890 |
35 |
890 ~ 1,000 |
40 |
1,000 ~ 1,150 |
45 |
1,150 ~ 1,300 | | |
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注:实际划痕宽度、刀刃伸出量的规格范围可以根据客户的实际需求作最优化的调整,以达到最合理的使用及性能。 |
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金刚石密度 |
1 |
2 |
3 |
低 (52 - 55%) |
标准 (55 - 58%) |
高 (58 - 62%) | |
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* Not designated in specification. |
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Thickness and Exposure Selection |
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Blade Selection Guide |
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Standard Model |
Internal Code |
Mian Application |
Wafer Thickness |
KH1 |
0815 |
M21 |
GaAs, GaP |
~ 250 |
KH2 |
0815 |
G12 |
Thin Wafer |
~ 200 |
KH3 |
0815 |
M23 |
Thin Wafer, Backside Chipping |
~ 300 |
0820 |
G34 |
ASIC |
200 ~ 300 |
0820 |
G35 |
IC, TR |
200 ~ 300 |
KH4 |
0820 |
G32 |
IC, TR |
200 ~ 300 |
1830 |
M33 |
Step Cut(1st), Bevel Cut |
200 ~ 400 |
KH5 |
1015 |
M21 |
Backside Chipping |
~ 300 |
1015 |
G34 |
SiC |
200 ~ 800 |
1230 |
G25 |
Step Cut(2nd), Bevel Cut |
200 ~ 800 |
KH6 |
1635 |
G21 |
TCP |
200 ~ 800 |
KH10 |
1615 |
M22 |
SiC, Bevel Cut(Glass, Quartz, SUS) |
~ 400 | |
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Diamond Distribution & Concentration |
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Front Side |
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Back Side |
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Cross Section(SEM) | | |
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